Title: Conquering UCIe 1.1 Multi-die System Verification Challenges

Speaker: Varun Agrawal, Synopsys

Abstract: The Universal Chiplet Interconnect Express (UCIe) v1.0 standard was introduced in March of 2022 and v1.1 was published in July 2023. There is a huge demand for an open chiplet ecosystem that will unleash innovation across the compute continuum which in turn increases the demand for power efficient and cost-efficient solutions.

UCIe 1.1 addresses four broad areas that encourage a thriving open chiplet ecosystem. These include enhancements like automotive segment, streaming protocol usages, cost optimization for advanced packages, and compliance testing.

This session focuses on key design considerations to bring forward the verification requirements and an overview of verification solution to enable UCIe 1.1 complex designs.